DIS-A-PASTE® 2000-A/B
Urethane Adhesive |
Thermally conductive urethane adhesive. Exceeds NASA outgassing requirements. Excellent adhesion/hydrolytic stability. |
DIS-A-PASTE 2001-PMF
Urethane Adhesive |
Designed to dissipate heat and bond dissimilar substrates with minimum stress. Pre-mixed, frozen, long pot-life version
DIS-A-PASTE 2000-A/B for robotic applications. |
DIS-A-PASTE 2003-A/B
Urethane Adhesive |
Thermally conductive, long pot-life, two-component version of
DIS-A-PASTE 2001-PMF. For customers with no freezer storage capacity. |
DIS-A-PASTE 2006-A/B
Urethane Adhesive |
Unfilled, clear, two-component, electrically insulating, urethane adhesive designed specifically for bonding PVC and other plastic substrates. Capable of room-temperature or accelerated heat cure. |
DIS-A-PASTE 2008-A/B
Urethane Adhesive |
Two-component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed for the potting of sensors and to dissipate device generated heat. |
DIS-A-PASTE 2310-PMF
Hybrid Urethane Adhesive |
Snap-cure, thermally conductive adhesive for surface mount applications. Extremely low modulus for a non-silicone. Flexible to –75°C. Cures in seconds via re-flow processing. Service temperature
up to 175°C (air)/225°C (N2). |
DIS-A-PASTE 2311-PMF
Hybrid Epoxy Adhesive |
Snap-cure, thermally conductive, long pot-life/stable viscosity- excellent for robotics. Minimal Z-axis movement during cure. Stronger than DIS-A-PASTE 2310-PMF. |
