Product |
Features |
APTEK® 2100-A/B
Urethane Encapsulant
and/or Potting Compound |
General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications. |
APTEK 2118-A/B
Urethane Encapsulant
and/or Potting Compound |
Unfilled urethane casting/tooling resin. Very high abrasion/tear strength. Capable of full cure at room temperature. |
APTEK 2125-A/B
Urethane Encapsulant
and/or Potting Compound |
Two-component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life. |
DIS-A-PASTE 2716-A/B
Silicone Encapsulant
and/or Potting Compound |
Two-component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates. Long pot life and low exotherm. |
APTEK 6100-1A/B
Epoxy Encapsulant |
Optoelectronic grade, water clear encapsulant for IR and visible LED discreet devices. Lower Tg versions available for display devices. |
APTEK 6103-A/B
Epoxy Encapsulant |
Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light. |
APTEK 6108-PMF
Epoxy Encapsulant
and/or Potting Compound |
High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C. Also can be used as a high temperature wire varnish/impregnant for motor stators. Available as a long pot-life, 2-component system. |
APTEK 6109-A/B
Epoxy Encapsulant |
Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices |
APTEK 6110-A/B
Epoxy Encapsulant
and/or Potting Compound |
Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, ower Tg versionof APTEK 6106-A/B, for good temparaturecycling in ceramic devices. |
APTEK 6519-A/B
Low CTE
Syntactic
Foam Compound |
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification
SCGMS 58001 Rev.L. |
APTEK 6527-A/B
Low CTE
Syntactic
Foam Compound |
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification
SCGMS 58001 Rev.L. |
APTEK 6550-A/B
Epoxy Encapsulant |
High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers. |
