APTEK 2125-A/B
Urethane Encapsulant
and/or Potting Compound |
Two-component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life. |
APTEK 6519-A/B
Low CTE
Syntactic
Foam Compound |
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification
SCGMS 58001 Rev.L. |
APTEK 6527-A/B
Low CTE
Syntactic
Foam Compound |
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification
SCGMS 58001 Rev.L. |
