Silver-filled, low modulus, low outgassing, urethane adhesive. Excellent adhesion to ceramic, metal and PCB substrates.
Space-grade, low modulus, low outgassing, Brushable, urethane ESD coating/adhesive. RT or low heat cure. Surface resistivity 4x106 ohms/square.
Snap-cure, one component, low modulus, low stress, silver-filled adhesive. Wide temperature operating range: -75 to +270°C (under N2).
Service temperature up to 175°C (air).
Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.
Low modulus silicone adhesive. Very low Tg for excellent temperature cycling performance. Available premixed-frozen, or in convenient 1:1 dual cartridge kits.
Two-component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. Designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solids system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.
Ultra-high ionic purity, silver-filled, meets requirements of MIL-A-87172, very low residual gas analysis. Available with gold filler.
Snap-cure, silver-filled, one–component;>20 hr flat-line viscosity-ideal for robotics;15 minute full cure @ 150°C.
General purpose, electrically conductive adhesive. Convenient 1/1 PBW or PBV mix ratio. RT or heat cure.
Carbon-filled, thixotropic, two component, electrically conductive, high strength epoxy coating/adhesive designed to dissipate an electrostatic charge. This low-outgassing system provides high strength over a wide temperature range.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.