View ISO Registration Certificate




Click on a link below to view technical data/specifications in PDF format. Adobe Reader is required for viewing all PDF files.

Product

Features
DIS-A-PASTE®
2150-PMF
Hybrid Epoxy
BGA Underfill
One-component, premixed-frozen, mineral filled, electrically insulating flexible underfill. It is designed to flow underneath BGA devices via capillary action and dissipate device-generated heat. Read a client test case article.
APTEK® 2512-A/B
Urethane
Conformal Coating
Mil-spec approved, JP 10 fuel resistant urethane conformal coating. Unfilled, two component, electrically insulating, transparent, flexible urethane coating system designed for the encapsulation and protection of electronic devices mounted on printed circuit boards.
APTEK 2711
Urethane ESD Coating
Inorganic, low outgassing, thermally radiative ESD white paint. Specially designed for very high temperature space applications.
APTEK 6103-A/B
Epoxy Encapsulant
Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.
APTEK 6513-A/B
Epoxy Adhesive
Two-component, semi-rigid, paste adhesive for bonding to steel, aluminum, wood, concrete, glass, ceramics, brass, and a variety of plastics. Designed to fully cure at room temperature or accelerated with moderate heat.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.

Home | Company Overview | Products | Technical Data Sheets | What's New | Newsletter | Glossary | FAQs | Site Map | Contact Us
Copyright © 2007 Aptek Laboratories, Inc. All rights reserved. Terms of Use | Privacy Statement | Trademarks
Site designed and hosted by Intevant™.