APTEK® 2100-7C/B
Urethane Staking Compound |
Semi pourable, thixotropic staking compound or encapsulant. RT or heat cure. Low modulus, outgassing. |
APTEK® 2120-PMF
Urethane Staking Compound |
One component, premixed frozen, long pot-life version of APTEK 2205-A/B. Low modulus, low Tg for excellent low temperature cycling and performance. Also used as a damming compound. |
APTEK® 2205-A/B
Urethane Staking Compound |
RT or heat cure. Easy-to-use pre-measured kits. Fast set for production/repair applications. Excellent hydrolytic stability. Qualified to WS 23708-1. Highly thixotropic. |
UVISTAKE™ 7205-PMF
UV Urethane
Staking Compound |
UV-cured, thixotropic, staking compound. Cures in shaded areas. Excellent adhesion to ceramics, metals, and plated substrates. Available in easy-to-use syringes. |
UVISTAKE™ 7206
UV Urethane
Staking Compound |
UV-cured, one component, RT stable, versatile wire staking compound. Low ionics for electronic applications. Excellent adhesion to metal and plastic PCB substrates. |
UVISTAKE™ 7207
UV Urethane
Staking Compound |
UV-cured, thixotropic, one component, electrically insulating, urethane system designed for the attachment and staking of electrical/electronic components. UVISTAKE 7207 is a thixotropic version of UVIBOND 7100. |
