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APTEK 6512-PMF is a one component, 100% solids, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards.

APTEK 6512-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.


  • Long RT pot life/snap heat cure–ideal for automated systems
  • High purity resin system for minimum level of ionic contamination to prevent corrosion problems
  • Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds it’s shape during heat cure for component staking applications.
  • Capable of curing @ 80°C to minimize harming heat- sensitive components.
  • Lower Tg version available for “reworkable-grade” adhesive for SMT
  • Available in various size syringes and alternative containers to meet application requirements.