Thermally Conductive / Electrically Insulative

DIS-A-PASTE  2000-A/B
Urethane Adhesive
Thermally conductive urethane adhesive. Exceeds NASA outgassing requirements. Excellent adhesion/hydrolytic stability.

DIS-A-PASTE 2001-PMF
Urethane Adhesive
Designed to dissipate heat and bond dissimilar substrates with minimum stress. Pre-mixed, frozen, long pot-life version DIS-A-PASTE 2000-A/B for robotic applications.

DIS-A-PASTE 2003-A/B
Urethane Adhesive
Thermally conductive, long pot-life, two-component version of DIS-A-PASTE 2001-PMF. For customers with no freezer storage capacity.

DIS-A-PASTE 2006-A/B
Urethane Adhesive
Mineral filled, clear, two-component, electrically insulating, urethane adhesive designed specifically for bonding PVC and other plastic substrates. Capable of room-temperature or accelerated heat cure.

DIS-A-PASTE 2008-A/B
Urethane Adhesive
Two-component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed for the potting of sensors and to dissipate device generated heat.

DIS-A-PASTE 2310-PMF
Hybrid Urethane Adhesive
Snap-cure, thermally conductive adhesive for surface mount applications. Extremely low modulus for a non-silicone. Flexible to –75°C. Cures in seconds via re-flow processing. Service temperature up to 175°C (air)/225°C (N2). Also available in multiple colors to indicate spacer bead thickness.

DIS-A-PASTE 2310HTC-PMF
Hybrid Urethane Adhesive
a higher thermal conductivity version of DIS-A-PASTE 2310-PMF, with a thermal conductivity of at least two times that of the standard product.

DIS-A-PASTE 2311-PMF
Hybrid Epoxy Adhesive
Snap-cure, thermally conductive, long pot-life/stable viscosity- excellent for robotics. Minimal Z-axis movement during cure. Stronger than DIS-A-PASTE 2310-PMF.

APTEK 6505LV
Epoxy Adhesive
A one component, 100% solids, mineral-filled, epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards and to provide a protective barrier underneath epoxy over-molded devices.