TECHNICAL DATA & INFORMATION – Click to view complete technical

Electronic-grade, non-conductive adhesive

PRODUCT DESCRIPTION

APTEK 6505-L.V. is a one component, 100% solids, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy over-molded devices.

APTEK 6505-L.V. displays excellent adhesion to various metal, ceramic, and PC board substrates.

KEY FEATURES AND BENEFITS

  • Long RT pot life/snap heat cure–ideal for automated systems
  • High purity resin system for minimum level of ionic contamination to prevent corrosion problems
  • Smooth consistency for machine stamping and syringe dispensing applications.
  • Capable of full cure @ 80°C to minimize harming heat- sensitive components.
  • Changes color when gelation occurs–takes the guess work out of knowing when material is gelled.
  • Lower Tg version available for “reworkable-grade” adhesive for SMT
  • Available in various size syringes and alternative containers to meet application requirements.