DIS-A-PASTE 2003-A/B

TECHNICAL DATA & INFORMATION - Click to view complete technical data

Long work life, thermally conductive urethane adhesive

PRODUCT DESCRIPTION

DIS-A-PASTE 2003-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat.

DIS-A-PASTE 2003-A/B is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

DIS-A-PASTE 2003-A/B is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environment. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

KEY FEATURES AND BENEFITS

  • Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates
  • Low Tg for excellent low temperature cycling and performance
  • Long work life with minimum viscosity change for robotic or large production operations
  • Excellent substrate adhesion; superior to silicones
  • Wide operating temperature range (-65˚C - 100˚C) for versatility
  • Exceeds NASA outgassing requirements for high vacuum environments
  • Bonds DAT-A-THERM™ 1000 film to devices and substrates without loss of thermal conductivity
  • Available in pre-mixed frozen syringes designated DIS-A-PASTE 2001-PMF
  • Product also available with 10 mil bondline spacers - designated DIS-A-PASTE 2003.010-A/B