Encapsulants & Potting Compounds

APTEK 2100-A/B
Urethane Encapsulant and/or Potting Compound
General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications.

APTEK 2100-PMF
Urethane Encapsulant and/or Potting Compound
A pre-mixed and frozen version of APTEK 2100-A/B. This form packaging is convenient for the end-user where the product is ready to use after thaw. However, storage at -60C or below is required.

APTEK 2118-A/B
Urethane Encapsulant and/or Potting Compound
Unfilled urethane casting/tooling resin. Very high abrasion/tear strength. Capable of full cure at room temperature.

APTEK 2125-A/B
Urethane Encapsulant and/or Potting Compound
Two-component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life.

APTEK 2217/0.005-PMF
Low Modulus Urethane Electrically Conductive, ESD, Adhesive
One-component, single component, pre-mixed and frozen, flexible urethane coating/adhesive designed to dissipate an electrostatic charge. This system provides a combination of high flexibility and good tensile strength/elongation characteristics. Contains 5 mil glass spacer beads to achieve a uniform bondline thickness.

DIS-A-PASTE 2716-A/B
Silicone Encapsulant and/or Potting Compound
Two-component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates. Long pot life and low exotherm.

APTEK 6100-1A/B
Epoxy Encapsulant
Optoelectronic grade, water clear encapsulant for IR and visible LED discreet devices. Lower Tg versions available for display devices.

APTEK 6103-A/B
Epoxy Encapsulant
Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.

APTEK 6108-PMF
Epoxy Coating/Encapsulant
High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C.

APTEK 6109-A/B
Epoxy Encapsulant
Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices.

APTEK 6110-A/B
Epoxy Encapsulant and/or Potting Compound
Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, ower Tg versionof APTEK 6106-A/B, for good temparaturecycling in ceramic devices.

APTEK 6113-A/B
Electrically Insulative, Epoxy, Potting Compound
A black, rigid, two component, mineral-filled, electrically insulative, low-shrinkage epoxy system specifically designed for the potting of larger electrical units like motor stators and transformers.

APTEK 6114-2-PMF
IR Transmitting/Visible Light Blocking Optoelectronic Epoxy Encapsulant
One component, unfilled, dark brown, rigid system designed for the encapsulation of IR LED chips in OPTO devices. Provides excellent environmental protection and when casted becomes the lens portion of the device designed to be transparent to IR light while blocking out visible light and therefore appears black when cast in mass.

APTEK 6115-PMF
IR Transmitting/Visible Light Blocking Optoelectronic Epoxy Encapsulant
A one component, unfilled, dark brown, rigid system designed for the encapsulation of IR LED chips in OPTO devices. APTEK 6115-PMF provides excellent environmental protection and when casted becomes the lens portion of the device designed to be transparent to IR light while blocking out visible light and therefore appears black when cast in mass.

APTEK 6519-A/B
Low CTE Syntactic Foam Compound
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification SCGMS 58001 Rev.L.

APTEK 6527-A/B
Low CTE Syntactic Foam Compound
Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification SCGMS 58001 Rev.L.

APTEK 6550-A/B
Epoxy Encapsulant
High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers.

UVISTAKE 7208-PMF
UV Curing, Low Outgassing, Urethane Staking Compound
An even higher thixtropic version of UVISTAKE 7205LM-PMF for non-sag applications. Meets NASA outgassing requirements per ASTM E-595 and is qualified to MIL-I-46058C.