TECHNICAL DATA & INFORMATION – Click to view complete technical

  • Low modulus urethane
  • High purity
  • Low outgassing
  • 4/1 PBV dual cartridge kits


APTEK 2125-A/B is a two component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life.

APTEK 2125-A/B is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environment. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.


  • Low modulus/high elongation to minimize stress to sensitive components and ceramic substrates.
  • Low Tg for excellent low temperature cycling and performance
  • Wide operating temperature range (-65°C to 100°C) for versatility.
  • Excellent substrate adhesion; superior to silicones
  • Exceeds NASA outgassing requirements for high vacuum environments
  • Low density for aerospace applications