TECHNICAL DATA & INFORMATION – Click to view complete technical

  • Thermally conductive, silicone potting compound
  • Re-enterable for repairability
  • Wide operating temperature range (-100°C to +260°C)


DIS-A-PASTE 2716-A/B is a two component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates.

  • Very low mixed viscosity to enhance the potting/encapsulation of intricate parts
  • Long pot life and low exotherm for mass casting of parts up to 5” thick
  • Very low Tg (-100°C) for excellent low temperature cycling and performance
  • Excellent substrate adhesion when used in conjunction with G.E. SS 4155 primer or DC 1200 primer
  • Available in dual cartridge kits for convenient dispensing to circuit board