Hybrid Epoxy BGA Underfill
One-component, premixed-frozen, mineral filled, electrically insulating flexible underfill. It is designed to flow underneath BGA devices via capillary action and dissipate device-generated heat. Read a client test case article.
Urethane ESD Coating
Inorganic, low outgassing, thermally radiative ESD white paint. Specially designed for very high temperature space applications.
Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.
Two-component, semi-rigid, paste adhesive for bonding to steel, aluminum, wood, concrete, glass, ceramics, brass, and a variety of plastics. Designed to fully cure at room temperature or accelerated with moderate heat.