APTEK 2100-A7C/B

TECHNICAL DATA & INFORMATION - Click to view complete technical

Low modulus urethane thixotropic encapsulant

PRODUCT DESCRIPTION

APTEK 2100-A7C/B is a thixotropic, medium viscosity, two component, electrically insulating, low modulus urethane system designed for the encapsulation of electrical/electronic components to printed circuit boards.

Although APTEK 2100-A7C/B is capable of achieving full cure at room temperature, however, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.

KEY FEATURES AND BENEFITS

  • 100% solids, solvent free system that will not form voids during cure or service life
  • Low Tg for excellent low-temperature cycling and performance
  • Very good substrate adhesion; superior to silicones
  • Exceeds NASA outgassing requirements for high vacuum environments