TECHNICAL DATA & INFORMATION – Click to view complete technical

Premixed-frozen, low modulus, low outgassing staking compound


APTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the staking of electrical/electronic components to printed circuit boards.

APTEK 2120-PMF is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

APTEK 2120-PMF is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.

  • Premixed-frozen and packaged in syringes for convenient dispensing to circuit board
  • Low modulus to minimize stress to sensitive components and ceramic substrates
  • Low outgassing for space applications and passes requirements of ASTM E-595
  • Low Tg for excellent low temperature cycling and performance
  • Excellent substrate adhesion; superior to silicones